Hybrid integration of InP photodetectors with SOI waveguides using thermocompression bonding
Year: 2010
Type: conference-paper
DOI: 10.1117/12.854403
Language: English
Topic: Photonic and Optical Devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2022075615
