Work

Multi Chip Module (MCM) Design for Packaging of a MEMS Pressure Sensor

Year: 2007

Type: conference-paper

Source: International Conference on Polymers and Adhesives in Microelectronics and Photonics

DOI: 10.1109/polytr.2007.4339131

Authors: Ashwin Mohan, Ajay P. Malshe, B. Sriram, K. Natarajan, S. Mohan

Institutions: University of Arkansas at Fayetteville, Bharat Electronics (India), Indian Institute of Science Bangalore

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2022280263

FWCI: 0.502

Cites: 11

Cited by: 2

Related to: 10