Year: 2012
Type: article
Abstract: We have developed ultra thin heat pipe which can be applied to thinner and lighter electronic equipments.In this study, we focused on optimizing vapor and liquid flow pressure drop in the heat pipe.As a result, we have succeeded in developing 1 mm thickness heat pipe which had maximum heat transfer rate of 22.1W.And also, we have developed ultra thin heat pipe which had both high maximum heat transfer rate and thin thickness by optimizing inner structure.In this paper, we reported development of ultra thin heat pipe and some applications of it.
Source: Frontiers in Heat Pipes
Authors: Hirofumi Aoki, Masami Ikeda, Yuichi Kimura
Institution: Furukawa Electric (Japan)
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $275
OpenAlex ID: W2023994635