Work

Thickness mapping of thin dielectrics with emission microscopy and conductive atomic force microscopy for assessment of dielectrics reliability

Year: 1996

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/relphy.1996.492072

Authors: B. Ebersberger, C. Boit, H. Benzinger, E. Gunther

Institution: Siemens (Germany)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2026558703

FWCI: 2.932

Cites: 8

Cited by: 6

Related to: 10