Work

Reliability analysis of the fine pitch connection using anisotropic conductive film (ACF)

Year: 2005

Type: article

Source: Microelectronics Journal

DOI: 10.1016/j.mejo.2005.10.002

Authors: Chao-Ming Lin, Win-Jin Chang, Te-Hua Fang

Institutions: WuFeng University, Kun Shan University, National Formosa University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Council

Awards: G3158847981, G5875553998, G6716324588

OpenAlex ID: W2034476578

FWCI: 0.922

Cites: 6

Cited by: 12

Related to: 10