In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation
Year: 2014
Type: article
Source: Applied Physics Letters
DOI: 10.1063/1.4896141
Authors: Xi Liu, Paragkumar A. Thadesar, Christine L. Taylor, Hanju Oh, Martin Kunz, Nobumichi Tamura, Muhannad S. Bakir, Suresh K. Sitaraman
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G5612048506
OpenAlex ID: W2035560415