Work

A low temperature integrated aluminum metallization technology for ULSI devices

Year: 1998

Type: article

Source: Thin Solid Films

DOI: 10.1016/s0040-6090(98)01032-3

Authors: Ted Guo, Liang Y Chen, Dirk Brown, Paul Besser, Steve Voss, Rod Mosely

Institutions: Applied Materials (United States), Advanced Micro Devices (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2038844481

FWCI: 0.555

Cites: 3

Cited by: 7

Related to: 10