Work

Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

Year: 2002

Type: article

Source: Materials Chemistry and Physics

DOI: 10.1016/s0254-0584(02)00232-8

Authors: G.A López, S Sommadossi, P Zieba, W Gust, E.J Mittemeijer

Institutions: University of Stuttgart, Max Planck Society, Max Planck Institute for Intelligent Systems, Institute of Metallurgy and Materials Science, Polish Academy of Sciences

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Alexander von Humboldt-Stiftung

OpenAlex ID: W2047879720

FWCI: 1.376

Cites: 13

Cited by: 47

Related to: 10