Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd
Year: 2008
Type: article
Source: Applied Surface Science
Institution: Lanzhou University
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: green
Funder: National Science Foundation
OpenAlex ID: W2048007259
