Work

Studies of surface mount technology and its risk analysis

Year: 2011

Type: conference-paper

Source: International Spring Seminar on Electronics Technology

DOI: 10.1109/isse.2011.6053581

Authors: Jan Jirsa, Karel Dusek

Institution: Czech Technical University in Prague

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2048835472

FWCI: 0.424

Cites:

Cited by: 4

Related to: 10