Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests
Year: 2006
Type: article
Source: Journal of Alloys and Compounds
Authors: Ying Ding, Chunqing Wang, Yanhong Tian, Mingyu Li
Institutions: Harbin Institute of Technology, University Town of Shenzhen
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2050516640