Work

Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization

Year: 2008

Type: article

Source: Applied Physics Letters

DOI: 10.1063/1.2841810

Authors: Ming-Hung Tsai, Chun-Wen Wang, Chia-Han Lai, Jien-Wei Yeh, Jon-Yiew Gan

Institution: National Tsing Hua University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2052018997

FWCI: 2.171

Cites: 29

Cited by: 104

Related to: 10