Work

Comparative study of polycrystalline Ti, amorphous Ti, and multiamorphous Ti as a barrier film for Cu interconnect

Year: 2005

Type: article

Source: Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

DOI: 10.1116/1.1852466

Authors: Keng-Liang Ou, Ming-Sun Yu, Ray-Quen Hsu, Ming-Hong Lin

Institutions: Taipei Medical University, Kaohsiung Veterans General Hospital, National Yang Ming Chiao Tung University, National Kaohsiung University of Applied Sciences

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Council

OpenAlex ID: W2053540959

FWCI: 0.72

Cites: 15

Cited by: 11

Related to: 10