Work

Near-CSP plastic ball grid array

Year: 2000

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/s0026-2714(00)00037-8

Author: Norman L Owens

Institution: Motorola (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2054748908

FWCI:

Cites: 2

Cited by:

Related to: 10