RF/wireless-interconnect: The next wave of connectivity
Year: 2011
Type: article
Authors: SaiWang Tam, Mau-Chung Frank Chang
Institution: University of California, Los Angeles
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2057094069