Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique
Year: 2012
Type: conference-paper
Abstract: We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer. We realized a fully functional working prototype of Autonomous Wireless Sensor Node system using AJP silver conductive track as an electrical interconnection.
Authors: S. Stoukatch, P. Laurent, S. Dricot, F. Axisa, L. Seronveaux, D. Vandormael, E. Beeckman, B. Heusdens, J. Destine
Institutions: University of Liège, Sirris
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
Funder: Waalse Gewest
OpenAlex ID: W2058715701