Work

Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

Year: 2012

Type: article

Source: Applied Physics Letters

DOI: 10.1063/1.4721661

Authors: Fei Pei, Nitin Jadhav, Eric Chason

Institution: Brown University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2059782818

FWCI: 3.401

Cites: 21

Cited by: 34

Related to: 10