Work

Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration

Year: 2006

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2006.10.052

Authors: B. Charlet, L. Di Cioccio, J. Dechamp, M. Zussy, T. Enot, R. Canegallo, A. Fazzi, R. Guerrieri, L. Magagni

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, STMicroelectronics (Italy), University of Bologna

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2060337673

FWCI: 2.625

Cites: 3

Cited by: 16

Related to: 10