Work

Thin Wafer Handling Challenges and Emerging Solutions

Year: 2010

Type: conference-paper

Source: ECS Transactions

DOI: 10.1149/1.3360713

Authors: Shari N. Farrens, Peter Bisson, Sumant Sood, James Hermanowski

Institutions: SUSS MicroTec (Switzerland), SUSS MicroTec (Germany)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2064856411

FWCI: 0.428

Cites:

Cited by: 10

Related to: 10