Work

Surface Impurities Encapsulated by Silicon Wafer Bonding

Year: 1990

Type: article

Source: Japanese Journal of Applied Physics

DOI: 10.1143/jjap.29.l2315

Authors: Takao Abe, Atsuo Uchiyama, Katsuo Yoshizawa, Yasuaki Nakazato, Mamoru Miyawaki, Tadahiro Ohmi

Institution: Tohoku University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2065311925

FWCI: 2.807

Cites: 8

Cited by: 22

Related to: 10