Work

Co-fired AlN–TiN assembly as a new substrate technology for high-temperature power electronics packaging

Year: 2013

Type: article

Source: Ceramics International

DOI: 10.1016/j.ceramint.2013.04.060

Authors: Zarel Valdez-Nava, Sophie Guillemet-Fritsch, Marc Ferrato, Masahiro Kozako, Thierry Lebey

Institutions: Centre National de la Recherche Scientifique, Université Toulouse III - Paul Sabatier, Institut National Polytechnique de Toulouse, Laboratoire Plasma et Conversion d'Energie, Université de Toulouse, Centre Interuniversitaire de Recherche et d’Ingénierie des Matériaux, Kyushu Institute of Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: green

OpenAlex ID: W2065664291

FWCI: 0.372

Cites: 12

Cited by: 7

Related to: 10