Work

Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn

Year: 2014

Type: article

Source: Journal of Alloys and Compounds

DOI: 10.1016/j.jallcom.2014.06.009

Authors: A.A. El-Daly, A.E. Hammad, G.S. Al-Ganainy, M. Ragab

Institutions: Zagazig University, Ain Shams University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2066445784

FWCI: 4.313

Cites: 23

Cited by: 55

Related to: 10