Work

The microstructure and the thermal expansion characteristics of Cu/SiCp composites

Year: 2003

Type: article

Source: Materials Science and Engineering A

DOI: 10.1016/s0921-5093(02)00788-8

Authors: Kuen-Ming Shu, G.C Tu

Institution: National Yang Ming Chiao Tung University

Language: English

Topic: Aluminum Alloys Composites Properties

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2067802458

FWCI: 3.565

Cites: 23

Cited by: 140

Related to: 10