Hydrophilicity of Silicon Wafers for Direct Bonding
Year: 1991
Type: article
Source: physica status solidi (a)
Authors: G. Kissinger, W. Kissinger
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2071946241