Work

Surface Damage on Si Substrates Caused by Reactive Sputter Etching

Year: 1981

Type: article

Source: Japanese Journal of Applied Physics

DOI: 10.1143/jjap.20.893

Authors: Norikuni Yabumoto, Masaharu Oshima, Osamu Michikami, Shizuka Yoshii

Institution: NTT (Japan)

Language: English

Topic: Low-Pressure Plasma Processing and Diagnostics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2074863563

FWCI: 8.967

Cites: 10

Cited by: 112

Related to: 10