Work

Effects of varying amplitudes on the fatigue life of lead free solder joints

Year: 2013

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2013.6575741

Authors: M. Obaidat, S. Hamasha, Y. Jaradat, A. Qasaimeh, B. Arfaei, M. Anselm, P. Borgesen

Institutions: Binghamton University, Universal Instruments (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: U.S. Department of Defense, Strategic Environmental Research and Development Program

OpenAlex ID: W2075740010

FWCI: 2.853

Cites: 6

Cited by: 32

Related to: 10