Work

Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests

Year: 2002

Type: conference-paper

Source: ASME International Mechanical Engineering Congress and Exposition (IMECE)

DOI: 10.1115/imece2002-32827

Authors: T. E. Wong, C. Y. Lau, L. A. Kachatorian, H. S. Fenger, I. C. Chen

Institution: Raytheon (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2077856478

FWCI: 0.356

Cites:

Cited by: 1

Related to: 10