Year: 2014
Type: article
Abstract: Co-B-P-W alloy films were deposited by the electroless plating method on Cu foil and on Si wafer with a sputtered PVD TaN/Ta barrier and Cu seed substrate. The effects of concentration of the reactants and temperature on the deposition rate were investigated. By variation of electroless plating solution composition, Co-W-P-B coatings containing different amounts of boron, phosphorus and tungsten can be obtained under slightly acid conditions. Using operating conditions selected Co-W-P-B coatings containing 0.5–10.0 at% W, 0.5–16.0 at% B and 1.5–6.0 at% P can be obtained. The induction period of the electroless deposition reaction depends on solution composition, but can be effectively shortened by elevation of the temperature of working solution.
DOI: 10.1149/2.0781409jes
Institution: Center for Physical Sciences and Technology
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2078201342