A Model for the Silicon Wafer Bonding Process
Year: 1989
Type: article
DOI: 10.1143/jjap.28.1735
Authors: R. Stengl, T. Tan, U. Gösele
Institution: Duke University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2081539999