Work

Single-chamber filament-assisted chemical vapor deposition of polymer and organosilicate films for air gap interconnect formation

Year: 2011

Type: article

Source: Thin Solid Films

DOI: 10.1016/j.tsf.2011.01.312

Authors: Eric Lee, Jacques Faguet, Jozef Brcka, Osayuki Akiyama, Junjun Liu, Dorel Toma

Institution: Tokyo Electron (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Massachusetts Institute of Technology

OpenAlex ID: W2084446277

FWCI: 0.255

Cites: 5

Cited by: 9

Related to: 10