Work

Thermoelectric characteristics and tensile properties of Sn–9Zn–xAg lead-free solders

Year: 2005

Type: article

Source: Journal of Alloys and Compounds

DOI: 10.1016/j.jallcom.2005.11.011

Authors: Fei-Yi Hung, Chih-Jung Wang, Sung-Min Huang, Li-Hui Chen, Truan-Sheng Lui

Institution: National Cheng Kung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2085758142

FWCI: 2.462

Cites: 9

Cited by: 30

Related to: 10