Work

Board level reliability of PBGA using flex substrate

Year: 2001

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/s0026-2714(01)00003-8

Authors: S.C Hung, P.J Zheng, S.H Ho, S.C Lee, H.N Chen, J.D Wu

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2089971990

FWCI: 1.602

Cites: 13

Cited by: 20

Related to: 10