Constitutive and damage model for a lead-free solder
Year: 2001
Type: article
Source: Journal of Electronic Materials
Authors: Shengmin Wen, Leon M. Keer, Hareesh Mavoori
Institutions: Northwestern University, Alcatel-Lucent (France)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2090501846