Optical method for testing of the packaging reliability of IC chips
Year: 2008
Type: conference-paper
DOI: 10.1117/12.819717
Authors: Xianming Xiong, Li Huang, Yanxiong Lin
Institution: Guilin University of Electronic Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2094512124