Work

Dishing Effects during Chemical Mechanical Polishing of Copper in Acidic Media

Year: 2000

Type: article

Source: Journal of The Electrochemical Society

DOI: 10.1149/1.1394116

Authors: Q. Luo, S. V. Babu

Institution: Clarkson University

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2094835375

FWCI: 5.677

Cites:

Cited by: 35

Related to: 10