Apply low-temperature plasma in the rework procedure of Al film structure to prevent pattern collapsed and CuAl 2 precipitation
Year: 2012
Type: conference-paper
DOI: 10.1117/12.917888
Authors: Jau Yu Tsai, Kung Hsun Tsao, Tsz Yuan Chen, Chih Chung Huang, Huan Hsin Yeh, Yu Huan Liu
Institution: United Microelectronics (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2095067151