Work

EQCM study of the effect of ligands on the rate of CuII reduction by formaldehyde

Year: 1999

Type: article

Source: Physical Chemistry Chemical Physics

DOI: 10.1039/a808956f

Authors: Z Jusys, R Pauliukaite´, A Vaškelis

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2097657487

FWCI: 0.444

Cites: 13

Cited by: 17

Related to: 10