Work

Electrothermal Analysis of Breakdown in Carbon Nanofiber Interconnects

Year: 2009

Type: article

Source: IEEE Electron Device Letters

DOI: 10.1109/led.2009.2016361

Authors: T. Yamada, T. Saito, D. Fabris, C.Y. Yang

Institution: Santa Clara University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2104842846

FWCI: 2.847

Cites: 16

Cited by: 33

Related to: 10