Work

Thermal analysis of an electronics enclosure: coupling flow network modeling (FNM) and computational fluid dynamics (CFD)

Year: 2002

Type: conference-paper

Source: Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings

DOI: 10.1109/stherm.2000.837062

Authors: T. Kowalski, A. Radmehr

Institution: Innovative Research (United States)

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2107905090

FWCI: 1.153

Cites: 4

Cited by: 17

Related to: 10