Work

A simple transducer model for longitudinal flip-chip bonding

Year: 2003

Type: conference-paper

Source: Proceedings/Proceedings - IEEE Ultrasonics Symposium

DOI: 10.1109/ultsym.2002.1193496

Authors: T. Sattel, M. Brokelmann

Institution: Paderborn University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2108523909

FWCI: 0.449

Cites: 1

Cited by: 6

Related to: 10