Laser Ultrasonic Instrumentation for Accurate Temperature Measurement of Silicon Wafers in Rapid Thermal Processing Systems
Year: 1998
Type: article
Source: MRS Proceedings
DOI: 10.1557/proc-525-135
Language: English
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2108872166
