Year: 2012
Type: article
Abstract: As current-stressing a Cu/Sn joint interface, the Cu atoms in the interfacial cathode Cu-Sn compound would experience the direct electromigration force and chemical potential force simultaneously, which have never been decoupled. In this work, a triple-junction Cu-Sn-Cu joint was designed and current-stressed to separate the above electromigration and chemical forces imposed on the Cu atoms in the Cu-Sn compound. In addition, by obtaining the individual value of the electromigration Cu flux in the cathode Cu 6 Sn 5 compound layer, the effective charge number (Z * ) of Cu atoms in the Cu 6 Sn 5 compound can be determined to be 35.6.
Source: ECS Solid State Letters
DOI: 10.1149/2.006205ssl
Authors: C. T. Lu, Y. J. Hu, Y. S. Liu, T. S. Huang, H. W. Tseng, C. Y. Chen, C. Y. Liu
Institution: National Central University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Award: G3503486993
OpenAlex ID: W2111584591