Work

Robust encapsulation of hybrid devices

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.1990.122249

Authors: J.A. Emerson, J.J. Sparapany, A.R. Martin, M.R. Bonneau, D.A. Burkhart

Institutions: AT&T (United States), Innovation, Science and Economic Development Canada

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2112640293

FWCI: 0.751

Cites: 12

Cited by: 6

Related to: 10