Work

Life time prediction for lead-free solder joints under vibration loads

Year: 2011

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/esime.2011.5765838

Authors: Karsten Meier, Mike Roellig, Andreas Schiessl, Klaus-Juergen Wolter

Institutions: Technische Universität Dresden, Continental (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2117203641

FWCI: 2.118

Cites: 3

Cited by: 15

Related to: 10