Work

Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center

Year: 2005

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2005-73375

Authors: James W. VanGilder, Roger R. Schmidt

Institution: IBM (United States)

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2120691045

FWCI: 11.58

Cites: 2

Cited by: 107

Related to: 10