Year: 2008
Type: conference-paper
Abstract: Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages has driven the semiconductor industry to develop more advanced packaging technologies.
Authors: Rozalia Beica, Charles Sharbono, Tom Ritzdorf
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2127665200