Design and fabrication of condenser microphone using wafer transfer and micro-electroplating technique
Year: 2008
Type: conference-paper
Abstract: A novel fabrication process, which uses wafer transfer and micro-electroplating technique, has been proposed and tested. In this paper, the effects of the diaphragm thickness andstress, the air-gap thickness, and the area ratio of acoustic holes to backplate on the sensitivity of the condenser microphone have been demonstrated since the performance of the microphone depends on these parameters. The microphone diaphragm has been designed with a diameter and thickness of 1.9 mm and 0.6 pm, respectively, an air-gap thickness of10 pm, and a 24% area ratio of acoustic holes to backplate. To obtain a lower initial stress, the material used for the diaphragm is polyimide. The measured sensitivities of the microphone at the bias voltages of24 V and12 V are −45.3 and −50.2 dB/Pa (at 1 kHz), respectively. The fabricated microphone shows aflat frequency response extending to 20 kHz.
Institution: National Chung Hsing University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2128669499