Work

3-D thin chip integration technology - from technology development to application

Year: 2009

Type: conference-paper

Source: IEEE International Conference on 3D System Integration (3DIC)

DOI: 10.1109/3dic.2009.5306578

Authors: T. Fritzsch, R. Mrossko, T. Baumgartner, M. Toepper, M. Klein, J. Wolf, B. Wunderle, H. Reichl

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Bundesministerium für Bildung und Forschung, Tekes, Technische Universität Berlin

OpenAlex ID: W2128763209

FWCI: 1.404

Cites: 12

Cited by: 7

Related to: 10