POD: A 3D-Integrated Broad-Purpose Acceleration Layer
Year: 2008
Type: article
Source: IEEE Micro
DOI: 10.1109/mm.2008.58
Institutions: Georgia Institute of Technology, Intel (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2129270189