Work

Silver diamond composite as a new packaging solution: A thermo-mechanical stability study

Year: 2011

Type: conference-paper

Source: Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings

DOI: 10.1109/stherm.2011.5767217

Authors: M. Faqir, T. Batten, T. Mrotzek, S. Knippscheer, M. Massiot, L. Letteron, S. Rochette, O. Vendier, J. M. Desmarres, F. Courtade, M. Kuball

Institutions: University of Bristol, Plansee (Austria), Thales Alenia Space (France), Centre National d'Études Spatiales

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2131809448

FWCI: 1.53

Cites: 8

Cited by: 2

Related to: 10